6 comments

  • vkaku 8 minutes ago
    A lot of the AI progress is stalled because these chips do not handle thermal contraction/expansion well at all, and end up permanently destroying these chips. HBM has been a failure at this scale with chips getting destroyed every 4 months or so during operations.

    I'd like to see some actual science saying, here was the problem, here's how we solved it, here's the AFR data, here's this running after X cycles etc. Nobody has done this reliably yet. That entire industry is hiding the bodies.

  • marsx-dev 11 minutes ago
    How much of the benefit here comes from shorter data paths, versus simply being able to fit more memory closer to the accelerator?
  • tancop 2 hours ago
    Where is the HBM controller in this design? Stacked in a middle layer or integrated into the main GPU die?
  • peter_d_sherman 3 days ago
    >"According to the company [Samsung],

    zHBM can deliver up to eight times the data-processing performance of eighth-generation High Bandwidth Memory (HBM5) while improving performance per watt by a factor of three.

    Thermal resistance is reduced by more than half, enhancing both system stability and energy efficiency."

  • senectus1 4 hours ago
    if all thats true, this is some impressive specs.
  • eis 1 hour ago
    I know consumers hate the situation with ram and storage prices right now, as do I. But at least on the bright side all this AI investment has unlocked a lot of progress in a space that didn't see huge advancements in a good while. All these 10-20% improvements gen-on-gen have resulted in upgrade cycles of well over 5 years for many use cases in order to really feel like it's worth it. RAM capacities especially have felt near stagnant for a decade.